Abstract: Born into a religious family, Ḥamka traveled extensively to acquire knowledge. Having gained mastery of Arabic, ḤAMKA translated the Qur’ān, commented extensively on its various aspects and used it as a tool for the purification of Islam in Indonesia.…

Las refl exiones sobre la producción de conocimiento dentro del área de la docencia y la investigación, y el debate que actualmente
se lleva a cabo para revisar el modo de generar conocimientos motivaron la realización de este ensayo, que…

To explore the spatial scales at which boreal forest birds respond to landscape structure and how those responses are influenced by forest harvest, we quantified the relationship between amounts of forest in the landscape at multiple spatial scales and the…

We propose a framework for studying the effect of KDD on CRM in the Egyptian banking sector. We believe that the KDD process and applications may perform a significant role in Egyptian banks to improve CRM, in particular for customer…

by Guru Prasanna., Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2001., Page 123 blank., Includes bibliographical references (p. 121-122).

by Roberta E. Bivins., Thesis (Ph. D.)--Massachusetts Institute of Technology, Program in Science, Technology, and Society, 1997., Includes bibliographical references (leaves 226-237).

by Nira Granott., Thesis (Ph. D.)--Massachusetts Institute of Technology, Program in Media Arts & Sciences, 1993., Includes bibliographical references (p. 431-442).

Characterization of defect is one of the important objectives of nondestructive evaluation (NDE) for condition assessment of structures. Among many other NDE techniques, ultrasonic methods play a prominent role in the both quantitative and qualitative assessment of discontinuities in reinforced…

Heavily used in the manufacture of integrated circuits, chemical-mechanical polishing (CMP) is becoming an enabling technology for microelectromechanical systems (MEMS). To reliably use CMP in the manufacturing process, designers must be able to accurately predict the CMP process and control…

Direct wafer bonding has emerged as an important technology in the manufacture of silicon-on-insulator substrates (SOI), microelectromechanical systems (MEMS), and three-dimensional integrated circuits (3D IC's). While the process is currently employed in applications such as these, a lack of knowledge…