Recent advances in microdroplet generation and deposition processes have made it possible to directly form solder bumps on integrated circuits using micron-sized molten metal droplets. The direct droplet deposition bumping process can potentially produce uniform-sized bumps more economically than the…

This paper seeks to engage the organization theory community in contemporary
debates over the role of the cxxporation in American society by building a stakeholder
theory of the t%n. We develop a set of normative premises and positivist propositions
derived…