The activity of designing and developing large, complex, discrete, physical, and engineered products faces the challenges in the physical product system, the organization of people, and the larger systems in which the product resides-the natural and societal systems. This thesis…

Direct wafer bonding has emerged as an important technology in the manufacture of silicon-on-insulator substrates (SOI), microelectromechanical systems (MEMS), and three-dimensional integrated circuits (3D IC's). While the process is currently employed in applications such as these, a lack of knowledge…