by Guru Prasanna., Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2001., Page 123 blank., Includes bibliographical references (p. 121-122).

The activity of designing and developing large, complex, discrete, physical, and engineered products faces the challenges in the physical product system, the organization of people, and the larger systems in which the product resides-the natural and societal systems. This thesis…

by Antoine D. Guivarch., Thesis (S.M.)--Massachusetts Institute of Technology, Engineering Systems Division, Technology and Policy Program; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2003., Includes bibliographical references (p. 149-152).

Direct wafer bonding has emerged as an important technology in the manufacture of silicon-on-insulator substrates (SOI), microelectromechanical systems (MEMS), and three-dimensional integrated circuits (3D IC's). While the process is currently employed in applications such as these, a lack of knowledge…

The purpose of this research was to generate the knowledge required to design compliant mechanisms that (1) attenuate undesired small-motion angular vibrations in rotational power transmission systems and (2) preserve the desired transmission of large-motion torque/angle inputs. This thesis investigates…

Cartilage functions as a load bearing and friction reducing material in synovial joints and it is constantly exposed to in vivo loading which is coupled to electromechanical and physicochemical forces. The swelling pressure of cartilage originates from proteoglycans containing negatively…

The water-gas shift reaction is an exothermic and reversible catalytic process that converts carbon monoxide and water (steam) to hydrogen and carbon dioxide. In regard to energy-related issues, the water-gas shift is part of the process of reforming hydrocarbons to…

Recent advances in microdroplet generation and deposition processes have made it possible to directly form solder bumps on integrated circuits using micron-sized molten metal droplets. The direct droplet deposition bumping process can potentially produce uniform-sized bumps more economically than the…