by Guru Prasanna., Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2001., Page 123 blank., Includes bibliographical references (p. 121-122).

Direct wafer bonding has emerged as an important technology in the manufacture of silicon-on-insulator substrates (SOI), microelectromechanical systems (MEMS), and three-dimensional integrated circuits (3D IC's). While the process is currently employed in applications such as these, a lack of knowledge…