This article reports the recent progress of re-search made in the Droplet-Based Manufacturing Laboratory at MIT. The study has been focused on obtaining a fundamental understanding of microdroplet deposition and applying the technology to various practical applications. Specific scientific contributions…

This paper presents the results of an ongoing effort to develop a direct solder bumping process for electronics packaging. The proposed process entails delivering molten droplets onto specific locations on electronic devices to form solder bumps. This study is focused…