This paper describes some problems and opportunities associated with conceptual modeling for the kind of "open systems" we foresee must and will be increasingly recognized as a central line of computer system development. Computer applications will be based on communication…

Direct wafer bonding has emerged as an important technology in the manufacture of silicon-on-insulator substrates (SOI), microelectromechanical systems (MEMS), and three-dimensional integrated circuits (3D IC's). While the process is currently employed in applications such as these, a lack of knowledge…