This study was designed to examine the ability to use prior knowledge in text comprehension and knowledge integration. The focus of the research was on effects of different degrees of subjects' theoretical knowledge in the domain of biochemistry on their…

by Guru Prasanna., Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2001., Page 123 blank., Includes bibliographical references (p. 121-122).

by Roberta E. Bivins., Thesis (Ph. D.)--Massachusetts Institute of Technology, Program in Science, Technology, and Society, 1997., Includes bibliographical references (leaves 226-237).

by Nira Granott., Thesis (Ph. D.)--Massachusetts Institute of Technology, Program in Media Arts & Sciences, 1993., Includes bibliographical references (p. 431-442).

Characterization of defect is one of the important objectives of nondestructive evaluation (NDE) for condition assessment of structures. Among many other NDE techniques, ultrasonic methods play a prominent role in the both quantitative and qualitative assessment of discontinuities in reinforced…

This study investigated the underlying factor structure of second language (L2) cloze test performance as explained by a theoretical model including the following hypothetical constructs: cloze-taking ability, knowledge of language, knowledge of text content, and knowledge of contextual constraints. Eight…

Heavily used in the manufacture of integrated circuits, chemical-mechanical polishing (CMP) is becoming an enabling technology for microelectromechanical systems (MEMS). To reliably use CMP in the manufacturing process, designers must be able to accurately predict the CMP process and control…

by Lori Faith Lamel., Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1988., Bibliography: leaves 140-150.

by Robert J. Grochowski., Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Civil Engineering, 1988., Includes bibliographical references.

Direct wafer bonding has emerged as an important technology in the manufacture of silicon-on-insulator substrates (SOI), microelectromechanical systems (MEMS), and three-dimensional integrated circuits (3D IC's). While the process is currently employed in applications such as these, a lack of knowledge…