1.
|
Wafer bonding : mechanics-based models and experiments Turner, Kevin Thomas, 1977-
|
2.
|
Effects of surface properties on solder bump formation by direct droplet deposition Hsiao, Wen Kai, 1972-
|
3.
|
Predicting and managing system interactions at early phase of the product development process Dong, Qi, 1973-
|
4.
|
Analysis of a duo-selecting membrane reactor for the water-gas shift Hardy, AliciA Jillian Jackson, 1978-
|